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News

Wenbo Yin to give Keynote talk

TetraMem's Wenbo Yin to give Keynote at Andes RISC-V Con on June 11 in San Jose

TetraMem Invited to Demo at TSMC

TetraMem is privileged to have been invited to take part in the 2024 TSMC Technology Symposium

TetraMem at TinyML

TetraMem Demos at TinyML

TetraMem published in Science

TetraMem Announces Publication in Science Journal, Advancing Analog Computing

TetraMem Featured in Semiconductor Review

TetraMem is honored to be named the top In-Memory Computing Solution of 2023 by Semiconductor Review

Announcing Another TetraMem IEEE Fellow

USC Professor and TetraMem Design Advisor Dr. Mike Chen Elevated to IEEE Fellow

TetraMem and Synopsys Collaboration Announcement

TetraMem and Synopsys Collaborate to Accelerate Development of Groundbreaking AI Accelerator Chips with Analog In-Memory Computing

TetraMem in IEEE Electron Devices

TetraMem recognized for contribution to cover art on current issue of IEEE Electron Devices

TetraMem in Advanced Materials September 2023

TetraMem Team Credited in Advanced Materials September 2023 Special Issue

TetraMem and Andes Technology Collaboration Announcement

Andes Technology and TetraMem Collaborate to Build Groundbreaking AI Accelerator Chip with Analog In-Memory Computing

TetraMem Inc and Research Collaborators' Article Published in Nature

Congratulations to TetraMem Inc’s team and their research collaborators on the publication of their research article in the prestigious scientific journal Nature.

TinyML Summit 2023

TetraMem will be exhibiting at the 2023 TinyML Summit.

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