TetraMem and Synopsys Collaborate to Accelerate Development of Groundbreaking AI Accelerator Chips with Analog In-Memory Computing

TetraMem recognized for contribution to cover art on current issue of IEEE Electron Devices

TetraMem Team Credited in Advanced Materials September 2023 Special Issue

Andes Technology and TetraMem Collaborate to Build Groundbreaking AI Accelerator Chip with Analog In-Memory Computing

Congratulations to TetraMem Inc’s team and their research collaborators on the publication of their research article in the prestigious scientific journal Nature.

TetraMem will be exhibiting at the 2023 TinyML Summit.

TetraMem is at CES 2023 in Las Vegas.

Dr. J. Joshua Yang is among a trio of USC Professors elected as part of this year’s class of National Academy of Inventors Fellows.

Another TetraMem Co-Founder Named IEEE Fellow:
TetraMem is pleased and honored that Dr. Qiangfei Xia, Co-Founder and Chief Process Advisor has been named IEEE Fellow effective January 1, 2023.

TetraMem will be back for the Linley Fall 2022 Processor Conference on November 1 - 2.

TetraMem executive team had the pleasure of visiting the MIT.nano facility.