top of page

News

TetraMem and Synopsys Collaboration Announcement

TetraMem and Synopsys Collaborate to Accelerate Development of Groundbreaking AI Accelerator Chips with Analog In-Memory Computing

TetraMem in IEEE Electron Devices

TetraMem recognized for contribution to cover art on current issue of IEEE Electron Devices

TetraMem in Advanced Materials September 2023

TetraMem Team Credited in Advanced Materials September 2023 Special Issue

TetraMem and Andes Technology Collaboration Announcement

Andes Technology and TetraMem Collaborate to Build Groundbreaking AI Accelerator Chip with Analog In-Memory Computing

TetraMem Inc and Research Collaborators' Article Published in Nature

Congratulations to TetraMem Inc’s team and their research collaborators on the publication of their research article in the prestigious scientific journal Nature.

TinyML Summit 2023

TetraMem will be exhibiting at the 2023 TinyML Summit.

TetraMem at CES 2023

TetraMem is at CES 2023 in Las Vegas.

TetraMem Co-founder Dr. Yang Elected National Academy of Inventors Fellow

Dr. J. Joshua Yang is among a trio of USC Professors elected as part of this year’s class of National Academy of Inventors Fellows.

Another TetraMem Co-Founder Named IEEE Fellow

Another TetraMem Co-Founder Named IEEE Fellow:
TetraMem is pleased and honored that Dr. Qiangfei Xia, Co-Founder and Chief Process Advisor has been named IEEE Fellow effective January 1, 2023.

TetraMem at Linley Fall 2022 Processor Conference

TetraMem will be back for the Linley Fall 2022 Processor Conference on November 1 - 2.

TetraMem visits MIT.nano

TetraMem executive team had the pleasure of visiting the MIT.nano facility.

AMcover.jpg
LinleyFallImage.jpg
Collage.jpg
bottom of page